Committees

Executive Committee

General Chair
Kirsten Moselund Paul Scherrer Institute (PSI) / EPFL

Technical Program Chair
Jan Hoentschel GlobalFoundries

Technical Program Vice Chair
Meng-Fan (Marvin) Chang National Tsing Hua University (NTHU) & TSMC

Publications Chair
Jungwoo Joh
Texas Instruments

Publications Co-Chair
Geert Eneman IMEC

Publicity Chair
Kang-ill Seo Samsung

Publicity Co-Chair
Gaudenzio Meneghesso University of Padova

Courses Chair
Dechao Guo
IBM

Courses Co-Chair (Short Courses)
Sandy Liao TSMC

Courses Co-Chair (Tutorials)
Olga Spahn Blum
Sandia National Laboratories

Focus Session and Special Events Chair
Srabanti Chowdhury Stanford University

Focus Session & Special Events Co-Chair
Uygar Avci Intel

Virtual Arrangements Chair
Sangbum Kim
Seoul National University

Asian Arrangements Chair
Chan Lim
SK Hynix

Asian Arrangements Co-Chair
Rihito Kuroda Tohoku University

European Arrangements Chair
John Paul Strachan
Forschungszentrum Juelich

European Arrangements Co-Chair
Elena Gnani
University of Bologna


Advanced Logic Technology

Youseok Suh, Chair Qualcomm

Veeraraghavan Basker
Applied Materials

Daphnee Bosch
Cea-Leti

Paul Grudowski
NXP

Byounghak Hong Samsung

Chung-Hsun Lin
Intel

Bich-Yen Nguyen
SOITEC

Martin O’Toole
ASML

Kazuyuki Tomida Rapidus

Maureen Wang TSMC

Koji Watanabe
TEL

Liesbeth Witters IMEC

Tenco Yamashita
IBM


Emerging Device and Compute Technology

Jaehyun Park , Chair
Samsung

Hyejung Choi
SK-Hynix

Veeresh Deshpande
IIT Bombay

Nazila Haratipour
Intel

Gage Hill
Harvard University

Louis Hutin
CEA-Leti

Adrian Ionescu
EPFL

David Michalak TNO

Farnaz Niroui
MIT

Tanja Roy
Duke University

Qiming Shao
Hong Kong University of Science and Technology

Maud Vinet
Siquance

Tomonari Yamamoto
Tokyo Electron Ltd.


Memory Technology

DerChang Kau, Chair
Intel

Wei-Chih Chien
Macronix

Nanbo Gong
IBM

Seiyon Kim
SK Hynix

Wanki Kim
Samsung

Yu-Ming Lin
TSMC

Johannes Mueller
Global Foundries

Andrea Redaelli
STMicroelectronics

Maarten Rosmeulen
imec

Swati Saha
Infineon

Hongmei Wang
Micron

Zhiqiang Wei
Avalanche Technologies

Shimeng Yu
Georgia Tech


Power, Microwave/Mm-Wave and Analog Devices/Systems

Veronique Sousa, Chair
CEA-Leti

Columbo Bolognesi
ETH Zurich

Ho-Young Cha
Honggik University

Kevin Chen
Hong Kong University of Science and Technology

Mengyuan Hua
Southern University Science & Technology

Vibhor Jain

Global Foundries

Brianna Klein
Sandia National Labs

Takuya Maeda
University of Tokyo

Munetaka Noguchi
Mitsubishi Electric Co.

Troy Olsson
University of Pennsylvania

Zhikai Tang
Texas Instruments

Hongping Zhao
Ohio State University


Modeling and Simulation

Vita Pi-Ho Hu, Chair National Taiwan University

Bruce Hsu
Macronix

Dipanjan Basu
Synopsys

Lado Filipovic
TU Wien

Bing Huang
Beijing Computational Science Research Center

Dongyean Oh
SK Hynix

Divya Prasad
AMD

Andries Scholten
NXP

Tzer-Min Shen
TSMC

Benoît  Sklénard
CEA-Leti

Dragica Vasileska
Arizona State University

Devin Verreck
IMEC

Jing Wang
NVIDIA


Neuromorphic Computing

Frank Martin, Chair

IBM

Gina Adam         
George Washington University

Christopher Bennett 
Sandia National Laboratories

Elisabetta Chicca
University of Groningen

Giuseppe Desoli
STMicroelectronics

Hidehiro Fujiwara            
TSMC

Catherine Graves

Google Brain

Daniele Ielmini  
Politecnico Milano

Thomas Kämpfe
Fraunhofer IPMS

Seyoung Kim  
POSTECH

Duygu Kuzum       
University of California San Diego

Po-Hao  Tseng   
Macronix

Huaquiang Wu           
Tsinghua University


Optoelectronics, Displays, and Imaging Systems

Pierre Magnan, Chair
Supaero-ISAE

Matteo Buffolo
University of Padova

KeunYeong Cho
Samsung

Frederic Lalanne
STMicroelectronics

Andreas Mai
IHP microelectronics

Rainer Minixhofer
AMS OSRAM

Kazuko Nishimura
Panasonic

Jun Ogi
Sony

Geunsook Park
Omnivision

Jamie Phillips
University of Delaware

Susanna Thon
Johns Hopkins University

Sergey Velicko
ON semiconductor

Pengyan Wen
Tongji University in Shanghai


Reliability of Systems and Devices

Michael Waltl, Chair
TU Wien

Zhou Huimei
IBM

KyoungChul Jang

SK Hynix

Ming-Yi Lee
Macronix

María Luque
Global Foundries

Inanc Meric
Intel

Motoyuki Sato
Tokyo Electron Limited

Azad Naeemi
Georgia Tech

Andrea Padovani
University of Modena

Susanna Reggiani
University of Bologna

Gerhard Rzepa
Global TCAD Solutions

Brecht Truijen
imec

Runsheng Wang
Peking University

Bonnie Weir
Broadcom


Sensors, MEMs, and Bioelectronics

Xiaoting Jia, Chair
Virginia Tech

Mirjana Banjevic
Sensirion AG

Dion Khodagholy
Columbia University, UC Irvine

Sheng-Shian Li
National Tsing Hua University

Pierpaolo Palestri
University of Modena and Reggio Emilia

Mina Rais-Zadeh
Michigan University, NASA

Roozbeh Tabrizian
University of Florida

Eng-Huat Toh
Global Foundries

Xinran Wang
Nanjing University

Man Wong
HKUST

Itaru Yanagi
Hitachi

Zhu Yao
A*STAR

Cunjiang Yu
University of Illinois, Urbana-Champaign