Committees
2025 IEEE IEDM Committees
2025 IEEE IEDM Executive Committee
General Chair
Jan Hoentschel GlobalFoundries
Technical Program Chair
Meng-Fan (Marvin) Chang National Tsing Hua University & TSMC
Technical Program Vice Chair
Jungwoo Joh
Texas Instruments
Publications Chair
Geert Eneman IMEC
Publications Co-Chair
Srabanti Chowdhury
Stanford University
Publicity Chair
Gaudenzio Meneghesso University of Padova
Publicity Co-Chair
John Paul Strachan
Forschungszentrum Juelich
Courses Chair
Sandy Liao TSMC
Courses Co-Chair (Short Courses)
Kang-ill Seo
Samsung
Courses Co-Chair (Tutorials)
Sangbum Kim
Seoul National University
Focus Session and Special Events Chair
Uygar Avci Intel
Focus Session & Special Events Co-Chair
Olga Blum
ARPA-e
Virtual Arrangements Chair
Dechao Guo
IBM
Asian Arrangements Chair
Rihito Kuroda Tohoku University
Asian Arrangements Co-Chair
Vita Pi-Ho Hu National Taiwan University
European Arrangements Chair
Elena Gnani
University of Bologna
European Arrangements Co-Chair
Michael Waltl TU Wien
Advanced Logic Technology
ByoungHak Hong, Chair Samsung
Veeraraghavan Basker
Applied Materials
Daphnee Bosch
Cea-Leti
Paul Grudowski
NXP
Byounghak Hong Samsung
Chung-Hsun Lin
Intel
Bich-Yen Nguyen
SOITEC
Martin O’Toole
ASML
Kazuyuki Tomida Rapidus
Maureen Wang TSMC
Koji Watanabe
TEL
Liesbeth Witters IMEC
Tenco Yamashita
IBM
Emerging Device and Compute Technology
Tania Roy, Chair
Duke University
Hyejung Choi
SK-Hynix
Veeresh Deshpande
IIT Bombay
Nazila Haratipour
Intel
Gage Hill
Harvard University
Louis Hutin
CEA-Leti
Adrian Ionescu
EPFL
David Michalak TNO
Farnaz Niroui
MIT
Tanja Roy
Duke University
Qiming Shao
Hong Kong University of Science and Technology
Maud Vinet
Quobly
Tomonari Yamamoto
Tokyo Electron Ltd.
Memory Technology
Nanbo Gong, Chair
IBM
Wei-Chih Chien
Macronix
Nanbo Gong
IBM
Seiyon Kim
SK Hynix
Wanki Kim
Samsung
Yu-Ming Lin
TSMC
Johannes Mueller
Global Foundries
Andrea Redaelli
STMicroelectronics
Maarten Rosmeulen
imec
Swati Saha
Infineon
Hongmei Wang
Micron
Zhiqiang Wei
Avalanche Technologies
Shimeng Yu
Georgia Tech
Power, Microwave/Mm-Wave and Analog Devices/Systems
Hongping Zhao, Chair
Ohio State University
Colombo Bolognesi
ETH Zurich
Ho-Young Cha
Honggik University
Kevin Chen
Hong Kong University of Science and Technology
Mengyuan Hua
Southern University Science & Technology
Vibhor Jain
Global Foundries
Brianna Klein
Sandia National Labs
Takuya Maeda
University of Tokyo
Munetaka Noguchi
Mitsubishi Electric
Troy Olsson
University of Pennsylvania
Zhikai Tang
Texas Instruments
Hongping Zhao
Ohio State University
Modeling and Simulation
Jing Wang, Chair Nvidia
Bruce Hsu
Macronix
Dipanjan Basu
Synopsys
Lado Filipovic
TU Wien
Bing Huang
Beijing Computational Science Research Center
Dongyean Oh
SK Hynix
Divya Prasad
AMD
Andries Scholten
NXP
Tzer-Min Shen
TSMC
Benoît Sklénard
CEA-Leti
Devin Verreck
IMEC
Jing Wang
NVIDIA
Neuromorphic Computing
Daniele Lelmini, Chair Politecnico di Milano
Gina Adam
George Washington University
Christopher Bennett
Sandia National Laboratories
Elisabetta Chicca
University of Groningen
Giuseppe Desoli
STMicroelectronics
Hidehiro Fujiwara
TSMC
Catherine Graves
Google Brain
Daniele Ielmini
Politecnico Milano
Thomas Kämpfe
Fraunhofer IPMS
Seyoung Kim
POSTECH
Duygu Kuzum
University of California San Diego
Po-Hao Tseng
Macronix
Huaquiang Wu
Tsinghua University
Optoelectronics, Displays, and Imaging Systems
Jun Ogi, Chair
Sony
Matteo Buffolo
University of Padova
KeunYeong Cho
Samsung
Frederic Lalanne
STMicroelectronics
Andreas Mai
IHP microelectronics
Rainer Minixhofer
AMS OSRAM
Kazuko Nishimura
Panasonic
Jun Ogi
Sony
Geunsook Park
Omnivision
Jamie Phillips
University of Delaware
Susanna Thon
Johns Hopkins University
Sergey Velicko
ON semiconductor
Pengyan Wen
Tongji University in Shanghai
Reliability of Systems and Devices
Bonnie Weir, Chair
Broadcom
Zhou Huimei
IBM
KyoungChul Jang
SK Hynix
Ming-Yi Lee
Macronix
María Luque
Global Foundries
Inanc Meric
Intel
Motoyuki Sato
Tokyo Electron Limited
Azad Naeemi
Georgia Tech
Andrea Padovani
University of Modena
Susanna Reggiani
University of Bologna
Gerhard Rzepa
Global TCAD Solutions
Brecht Truijen
imec
Runsheng Wang
Peking University
Bonnie Weir
Broadcom
Sensors, MEMs, and Bioelectronics
Sheng-Shian Li, Chair
National Tsing Hua University
Mirjana Banjevic
Sensirion AG
Dion Khodagholy
Columbia University, UC Irvine
Sheng-Shian Li
National Tsing Hua University
Pierpaolo Palestri
University of Modena and Reggio Emilia
Mina Rais-Zadeh
Michigan University, NASA
Roozbeh Tabrizian
University of Florida
Eng-Huat Toh
Global Foundries
Xinran Wang
Nanjing University
Man Wong
HKUST
Itaru Yanagi
Hitachi
Zhu Yao
A*STAR
Cunjiang Yu
University of Illinois, Urbana-Champaign