Typical Themes

• CMOS platform technologies & opportunities

• Logic device performance and circuit design challenges

New or Trending Areas

• GAA (vertically stacked) nanosheets based devices and circuits; new channel materials

• Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, thermal management

• Logic for memory

• Interconnects (BEOL, Backside power delivery)

• BEOL compatible transistors

• Advanced, novel process integration schemes and (applications-driven) scaling approaches

• Process module innovations and progresses in process control & process metrology

• Device technology co-optimization (DTCO), System technology co-optimization (STCO)

Typical Themes

• 2D and devices on low-dimensional materials

• Non-CMOS emerging devices

• Neuromorphic and approximate computing devices

• Spintronic and magnetic devices

• Steep-slope devices

• Quantum computing devices

New or Trending Areas

• Topological materials and devices, and phase transitions transistors

• Emerging state machines, time dynamical systems, approximate computing

• Novel cryogenic devices

Typical Themes

• Conventional memories

• Emerging memories

• 3D memory technologies

• Memories for AI and near-memory computing applications

• In-Package memory for PPA augmentation

New or Trending Areas

• Memories to break the memory wall

• Memory-enabled artificial intelligence applications

• Memory-logic 3D stacking

• System-technology co-optimization

• Memory pooling and communication

• New memory hierarchy

Typical Themes

• Technology CAD and benchmarking

• Advanced logic and memory device modeling

• Atomistic material, process, and interconnect simulation

• Compact models for DTCO

• Alternative computing device modeling

• Nanoscale (bio) sensors modeling

New or Trending Areas

• Multi-scale simulation with hybrid techniques

• Advanced packaging and 3D integration modeling

• Thermal modeling

• Low-temperature and quantum device modeling

• Device modeling for photonics

• Device modeling for in-memory and in-sensor computing

Typical Themes

• SRAM, DRAM, Flash, ReRAM, MRAM, PCRAM, ferroelectric memory, and memory selector for analog in-memory deep learning

• Memory, logic, and nanoelectronic devices with novel functions and/or materials for new and unconventional compute paradigms

• Probabilistic and approximate computing enabled by stochastic behaviors of devices and materials

• Emerging computing algorithms enabled by memory, logic, and nanoelectronic devices

New or Trending Areas

• Device-algorithm co-optimization

• Monolithic 3D integration for neuromorphic computing

• Neuromorphic sensors and in-sensor computing

Typical Themes

• Heterogeneous optoelectronic integration including sources, modulators or detectors

• Neuromorphic photonics

• Single photon emitters and detectors

• Luminescent devices based on new materials including perovskites and quantum dots

• Displays and imagers for augmented or virtual reality

• Holographic devices and displays

• Displays with unconventional form or size

• Photodetectors and imagers with new materials or flexible platform and printed electronics

• Imagers with unconventional spectral bandwidth, high sensitivity, or high time-resolution

• Image sensors with pixels for range sensing, TOF, RGBZ, LIDAR

New or Trending Areas

• Photonic devices for quantum computation and sensing

• Intelligent Image sensors

• Advanced on-chip optics for imagers

• In-display and under-display sensors

Typical Themes

• Power and/or high speed (microwave to THz devices) devices, modules, and systems

• Manufacturing processes, device design, modeling, physics, and reliability of power and/or high-speed devices

• Fundamental studies on doping, traps, interface states, and device reliability for power and/or high-speed switching devices

• Micro and mm-wave devices, such as PAs, LNAs, switches and mixers.

• Energy harvesting devices and circuits

• Tunable passives, SAW/BAW devices, antenna arrays

New or Trending Areas

* Wide bandgap and ultra-wide bandgap semiconductors such as SiC, (Al)GaN, diamond, β-Ga2O3, BN

* Power devices for applications for automotive and aviation to smart grid

* Device and circuits for 5G and 6G

* Antenna arrays and beam forming

* Extreme environment power and high-speed devices

k_t² of Sc_xAl_1−xN* piezoelectric material: LNO, LTO, AIN(Sc)…

Typical Themes

• Component level of FEOL/MEOL/BEOL reliability model

• Robustness and security of electronic circuits and systems

New or Trending Areas

• Reliability of new materials and/or new architectures for transistors

• Reliability of advanced 2.5D/3D IC advanced package

• Design for testing (DFT) / Design for reliability (DFR) solutions for improved reliability

• Reliability of conventional and emerging memories

• Circuits, systems-level reliability, and aging

• Thermal and PID/charging management in existing and novel process integration

• Reliability of RF/mm-wave/5G in high-frequency

  applications

• Reliability of devices, circuits, and systems for more-than-Moore applications, automotive, aerospace and bio-applications (BioFETs, DNA detection, etc.)

• Reliability of cryogenic devices for future quantum

  computing applications

Typical Themes

• Physical and biochemical integrated sensors

• Energy harvesting and storage devices

• Flexible devices for wearable applications

• MEMS for Internet of Things

• Bio-electronic interfaces and implantable devices

New or Trending Areas

• Intelligent sensors with embedded AI

• Multimodal biochemical and physical sensors for healthcare

• Sensors and devices for human-machine interface

• Hybrid organic/inorganic microfabrication and device