IEDM

Call for Papers Overview

2020 IEDM CALL FOR PAPERS

The Annual International Electron Devices Meeting
will be held at the Hilton San Francisco Union Square
San Francisco, CA
December 12-16, 2020

DOWNLOAD the 2020 Call for Papers

Abstract Deadline : July 24, 2020

The paper submission deadline has been moved from June to July for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.

 Typical themes of interest in IEDM2019:New or trending areas:
ADVANCED LOGIC TECHNOLOGY (ALT)• CMOS platform technologies
• Logic device performance and circuit design challenges
• Advanced process integration schemes and scaling approaches
• Process module and process control advancements
• Device technology co-optimization solutions

• SiGe/Ge channel, GAA nanowire and stacked nanosheet
• Stacked and monolithic 3D integration
• BEOL compatible transistors
EMERGING DEVICE and COMPUTE TECHNOLOGY (EDT)• 2D and devices on low-dimensional materials
• Neuromorphic and approximate computing concepts and devices
• Spintronic and magnetic devices
• Steep-slope devices
• Quantum computing devices
• Topological insulators and phase transition transistors
• Emerging state machines, continuous time dynamical systems
MEMORY TECHNOLOGY (MT)• Conventional memories
• Emerging memories
• 3D memory technologies
• Computing-in-memory
• Memory for bio-inspired computing
• Novel materials and devices for ferroelectric memories
• Emerging memories for spiking neural networks
• Memory-enabled artificial intelligence applications
MICROWAVE, MILLIMETER WAVE and ANALOG TECHNOLOGY (MAT)• High Performance III-V and Si devices for mm-wave and THz
• Power device technologies for micro and mm-wave
• Micro and mm-wave analog front ends, PAs, LNAs and mixers
• Energy harvesting devices and circuits
• Tunable passives, SAW/BAW devices, antenna arrays
• Device and circuits for 5G and beyond
• Millimeter-wave power
• Antenna arrays and beam forming
MODELING AND SIMULATION (MS)• Technology CAD and benchmarking
• Memory and alternative computing device modeling
• Physics-based compact models
• Atomistic process and device modeling
• Design-oriented modeling: variability, reliability and yield
• Atomistic-device hybrid modeling at large scale
• Advanced integration and packaging modeling
• Device and interconnect modeling for quantum computing
OPTOELECTRONICS, DISPLAYS, and IMAGING SYSTEMS (ODI)• Heterogeneous optoelectronic integration (incl. sources, modulators)
• High-speed wafer-level photonic-electronic integration
• Organic and inorganic displays
• Imagers (high time-resolution, high-sensitivity)
• Large-scale optoelectronic integration for sensors
• Thin film transistors, flexible, stretchable, and printed electronics
• Optoelectronic integration for neuromorphic and quantum computing
• VCSEL sensors, microLED, flexible displays
POWER DEVICES and SYSTEMS (PDS)• Power devices, modules and systems
• System-level impact of power devices
• Manufacturing processes, device design, modeling, physics, and reliability of power devices
• Fundamental studies on doping, traps, interface states and device reliability for power switching devices
• New wide-bandgap semiconductors
• Newer applications from automotive to smart grid
• Power device reliability
RELIABILITY OF SYSTEMS and DEVICES (RSD)• Reliability of FEOL/MEOL/BEOL, latch‐up and ESD
• Design for reliability and variability-aware design
• Robustness and security of electronic circuits and systems
• Reliability of devices and systems for biomedical, automotive and aerospace
• Degradation mechanisms of emerging memories
• Reliability of devices, circuits and systems for more-than-Moore
• Reliability of biomedical and wearable devices, circuits and systems
• Reliability of 5G, IoT, automotive and aerospace devices circuits and systems
SENSORS, MEMS, and BIOELECTRONICS (SMB)• Physical and biochemical integrated sensors
• Energy harvesting and storage devices
• Flexible devices for wearable applications
• MEMS for Internet of Things
• Bio-electronics and implantable devices for health applications
• Optomechanical devices and sensors
• Hybrid organic/inorganic
• Sensors and devices for brain computer interfaces