IEDM

2018 IEDM Short Courses

 

IEDM will offer two, full-day short courses with in-depth coverage of highly relevant topics from world experts. Advance registration is recommended. Details on the short courses will be published later this year.

Sunday, December 2, 2018, 9:00 a.m. – 5:30 p.m.

Short Course 1: Scaling Survival Guide in the More than Moore Era

Course Organizer:  Jin Cai, TSMC

  • Extreme UV Lithography: The Road to HVM and Beyond, Anthony Yen, ASML
  • MOSFET Scaling Knobs (GAA, NCFET…) and Future Alternatives, Witek Maszara
  • Overcoming Variation Challenges, Sivakumar Mudanai, Intel
  • 3D Integration for Density and Functionality, Julien Ryckaert, imec
  • Advanced Packaging: the Next Frontier for Moore’s “Law”, Subramanian Iyer, UCLA
  • Embedded Memory: Present Status, and Emerging Architecture and Technology for Future Applications, Eric Wang, TSMC

Short Course 2: Its All About Memory, Not Logic!!!

Course Organizer:  Nirmal Ramaswamy, Micron

  • DRAM : Its Challenging History and Future, Dong Soo Woo, Samsung
  • 3D Flash Memories: Overview of Cell Structures, Operations and Scaling Challenges, Makoto Fujiwara, Toshiba
  • Emerging Memories including Cross-Point, Opportunities and Challenges, Kiran Pangal, Intel
  • Memory Reliability, Qualification and their Relation to System Level Reliability Strategies, Todd Marquart, Micron
  • Future of the Packaging Technologies for HBM, Nick (Namseog) Kim, SK Hynix
  • Processing in Memory (PIM): Performance and Thermal Challenges and Opportunities, Mircea Stan, University of Virginia

 

TO PERMIT SPONTANEOUS AND CANDID DISCUSSION, NO VERBATIM RECORDING BY TAPE OR CAMERA WILL BE PERMITTED IN ANY OF THE SHORT COURSES.