2016 IEDM Tutorials

The tutorials are in their sixth year and are 90 minute stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are intensive full-day events focused on a single technical topic.

The tutorial sessions will take place on Saturday, December 3rd. Three tutorials are given in parallel in two time slots, at 2:45 p.m.and 4:30 p.m. respectively.


Topics presented at 2:45 – 4:15 p.m:

  • The Struggle to Keep Scaling BEOL, and What We Can Do Next, Rod Augur, Distinguished Member of the Technical Staff, GlobalFoundries – Looking ahead, it’s the interconnect that threatens further cost-effective scaling. The tutorial will cover challenges and trade-offs in back-end-of-the-line (BEOL) scaling, and will evaluate emerging devices from a scaled-BEOL viewpoint.
  • Physical Characterization of Advanced Devices, Robert Wallace, Univ. Texas at Dallas – This tutorial will cover the hardware, physics, and chemistry that enable modern physical characterization of novel electronic materials, and will explore how these techniques can shed light on electronic materials research and development, and on the resultant devices. In addition to introducing examples of novel electronic materials for device applications, example techniques discussed will include high-resolution electron microscopy, scanning tunneling microscopy and spectroscopy, dynamic x-ray photoelectron spectroscopy, and ion mass spectrometry. The detection limits of these techniques and how they relate to device behavior also will be discussed.
  • Spinelectronics: From Basic Phenomena to Magnetoresistive Memory (MRAM) Applications, Bernard Dieny, Chief Scientist, Spintec CEA — This tutorial will cover spintronics phenomena, magnetic tunnel junctions (growth, magnetic and transport properties), field-written MRAM (toggle and thermally assisted MRAM), STT-MRAM (principle and status of development), 3-terminal MRAM and innovative architectures that benefit from these high-endurance non-volatile memories.

Topics presented at 4:30 p.m.-6:00 p.m:

  • Electronic Circuits and Architectures for Neuromorphic Computing Platforms, Giacomo Indiveri, Univ. of Zurich and ETH Zurich – This tutorial will cover the principles and origins of neuromorphic (i.e., brain-inspired) engineering, examples of neuromorphic circuits, how neural network architectures can be used to build large-scale multi-core neuromorphic processors, and some specific application areas well-suited for neuromorphic computing technologies.
  • Present and Future of FEOL Reliability—from Dielectric Trap Properties to Reliable Circuit Operation, Ben Kaczer, Principal Scientist, Imec – This tutorial will introduce the main degradation mechanisms occurring in present-day CMOS. The reliability of novel devices (SiGe, IIIV, gate-all-around nanowires, junctionless FETs, tunnel FETs), of deeply-scaled devices, and of circuits (e.g., “reliability-aware” designs) will be covered in detail. The tutorial will give attendees an overview and background in this area sufficient to allow them to follow and participate in any discussion on reliability in general, and on front-end-of-the-line (FEOL) reliability in particular.
  • Embedded Systems and Innovative Technologies for IoT Applications, Ali Keshavarzi, Vice President of R&D, Cypress Semiconductor – Pervasive IoT systems are making our lives easier with an enhanced user experience in a variety of widely deployed applications. Sub-systems and features of IoT embedded microsystems and their key technical requirements will be described. Energy efficiency of the future intelligent IoT systems require balancing of computing and communication locally at the IoT node calling upon both Moore’s Law and Shannon’s Law in concert. Innovative technologies to create power-differentiated and cost-effective solutions for future IoT applications will be explained; including differentiated SONOS eNVM, low-power radios and small form-factor system-in-package technologies. We compare them with alternative competitive technologies and explore how participants’ future innovations can be integrated in IoT systems. eNVM is critical in enabling autonomous IoT systems that rely on intermittent source of energy for program, data, security and advanced networking protocols. Finally, we will demonstrate a low-energy IoT system for agriculture that uses solar energy harvesting and conclude by describing a vision of future IoT systems.