2025 IEEE IEDM Call for Papers - themes and trending areas will be updated May 1, 2025

The Annual IEEE International Electron Devices Meeting will be held at the Hilton San Francisco Union Square in San Francisco, CA, from December 6-10, 2025.

Key Dates

  • Submission Deadline is: Thursday, July 10, 2025 23:59 PDT

  • Late News Submission Deadline: August 18, 2025 23:59 PDT

The paper submission deadline is July 10 for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.

ADVANCED LOGIC TECHNOLOGY (ALT)

Typical Themes

  • CMOS platform technologies & opportunities

  • Logic device performance and circuit design challenges

  • Advanced, novel process integration schemes and (applications-driven) scaling approaches

  • Process module innovations and progresses in process control & process metrology

  • Device technology co-optimization (DTCO), System technology co-optimization (STCO)

New or Trending Areas

  • GAA (vertically stacked) nanosheets based devices and circuits; new channel materials

  • Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, thermal management

  • Logic for memory

  • Interconnects (BEOL, Backside power delivery)

  • BEOL compatible transistors

EMERGING DEVICE and COMPUTE TECHNOLOGY (EDT)

Typical Themes

  • 2D and devices on low-dimensional materials

  • Non-CMOS emerging devices

  • Neuromorphic and approximate computing devices

  • Spintronic and magnetic devices

  • Steep-slope devices

  • Quantum computing devices

New or Trending Areas

  • Topological materials and devices, and phase transitions transistors

  • Emerging state machines, time dynamical systems, approximate computing

  • Novel cryogenic devices

MEMORY TECHNOLOGY (MT)

Typical Themes

  • Conventional memories

  • Emerging memories

  • 3D memory technologies

  • Memories for AI and near-memory computing applications

  • In-Package memory for PPA augmentation

New or Trending Areas

  • Memories to break the memory wall

  • Memory-enabled artificial intelligence applications

  • Memory-logic 3D stacking

  • System-technology co-optimization

  • Memory pooling and communication

  • New memory hierarchy

MODELING AND SIMULATION (MS)

Typical Themes

  • Technology CAD and benchmarking

  • Advanced logic and memory device modeling

  • Atomistic material, process, and interconnect simulation

  • Compact models for DTCO

  • Alternative computing device modeling

  • Nanoscale (bio) sensors modeling

Typical Themes

  • SRAM, DRAM, Flash, ReRAM, MRAM, PCRAM, ferroelectric memory, and memory selector for analog in-memory deep learning

  • Memory, logic, and nanoelectronic devices with novel functions and/or materials for new and unconventional compute paradigms

  • Probabilistic and approximate computing enabled by stochastic behaviors of devices and materials

  • Emerging computing algorithms enabled by memory, logic, and nanoelectronic devices

New or Trending Areas

  • Multi-scale simulation with hybrid techniques

  • Advanced packaging and 3D integration modeling

  • Thermal modeling

  • Low-temperature and quantum device modeling

  • Device modeling for photonics

  • Device modeling for in-memory and in-sensor computing

NEUROMORPHIC and NOVEL COMPUTING (NC)

New or Trending Areas

  • Device-algorithm co-optimization

  • Monolithic 3D integration for neuromorphic computing

  • Neuromorphic sensors and in-sensor computing

OPTOELECTRONICS, DISPLAYS, and IMAGING SYSTEMS (ODI)

Typical Themes

  • Heterogeneous optoelectronic integration including sources, modulators or detectors

  • Neuromorphic photonics

  • Single photon emitters and detectors

  • Luminescent devices based on new materials including perovskites and quantum dots

  • Displays and imagers for augmented or virtual reality

  • Holographic devices and displays

  • Displays with unconventional form or size

  • Photodetectors and imagers with new materials or flexible platform and printed electronics

  • Imagers with unconventional spectral bandwidth, high sensitivity, or high time-resolution

  • Image sensors with pixels for range sensing, TOF, RGBZ, LIDAR

New or Trending Areas

  • Photonic devices for quantum computation and sensing

  • Intelligent Image sensors

  • Advanced on-chip optics for imagers

  • In-display and under-display sensors

POWER, MILLIMETER WAVE AND ANALOG TECHNOLOGY (PMA)

Typical Themes

  • Power and/or high speed (microwave to THz devices) devices, modules, and systems

  • Manufacturing processes, device design, modeling, physics, and reliability of power and/or high-speed devices

  • Fundamental studies on doping, traps, interface states, and device reliability for power and/or high-speed switching devices

  • Micro and mm-wave devices, such as PAs, LNAs, switches and mixers.

  • Energy harvesting devices and circuits

  • Tunable passives, SAW/BAW devices, antenna arrays

New or Trending Areas

  • Wide bandgap and ultra-wide bandgap semiconductors such as SiC, (Al)GaN, diamond, β-Ga2O3, BN
  • Power devices for applications for automotive and aviation to smart grid
  • Device and circuits for 5G and 6G
  • Antenna arrays and beam forming
  • Extreme environment power and high-speed devices
  • kt2 of ScxAl1−xN piezoelectric material: LNO, LTO, AIN(Sc)…

RELIABILITY OF SYSTEMS and DEVICES (RSD)

Typical Themes

  • Component level of FEOL/MEOL/BEOL reliability model

  • Robustness and security of electronic circuits and systems

  • Reliability of conventional and emerging memories

  • Circuits, systems-level reliability, and aging

  • Thermal and PID/charging management in existing and novel process integration

  • Reliability of RF/mm-wave/5G in high-frequency

    applications

  • Reliability of devices, circuits, and systems for more-than-Moore applications, automotive, aerospace and bio-applications (BioFETs, DNA detection, etc.)

  • Reliability of cryogenic devices for future quantum

    computing applications

New or Trending Areas

  • Reliability of new materials and/or new architectures for transistors

  • Reliability of advanced 2.5D/3D IC advanced package

  • Design for testing (DFT) / Design for reliability (DFR) solutions for improved reliability

SENSORS, MEMS, and BIOELECTRONICS (SMB)

Typical Themes

  • Physical and biochemical integrated sensors

  • Energy harvesting and storage devices

  • Flexible devices for wearable applications

  • MEMS for Internet of Things

  • Bio-electronic interfaces and implantable devices

New or Trending Areas

  • Intelligent sensors with embedded AI

  • Multimodal biochemical and physical sensors for healthcare

  • Sensors and devices for human-machine interface

  • Hybrid organic/inorganic microfabrication and device