IEDM

2017 IEDM PROGRAM

IEDM Focus Sessions

IEDM 2017 features four Special Focus Sessions with invited talks from world experts to highlight the latest developments in emerging sectors of semiconductor technology:

3D-Integration and Packaging (Session 3)

An industry perspective of packages to come: “Simpler is better” to “Advanced Packaging saves the day for continued scaling”.  The session will address the latest in 3D, from alternative packaging to 3D stacking, applications and technologies for Integrated Power Microelectronics.

  • “3D sequential integration: Application driven technological achievements and guidelines,” by Perrine Batude et al, CEA LETI
  • “Pixel/DRAM/Logic 3-layer Stacked CMOS image sensor technology,” by Hidenobu Tsugawa et al, Sony Semiconductor Solutions Corp.
  • “Power Inside – Applications and Technologies for Integrated Power in Microelectronics,” Cian O’Mathuna, University of Cork
  • “3D System Package architecture as alternative to 3D Stacking of Ics with TSV at System level,” by Rao Tummala, Georgia Institute of Technology
  • “Advanced Packaging Saves the Day! – How TSV Technology Will Enable Continued Scaling,” by Luke England et al, Global Foundries.
  • “Advanced Packaging with greater simplicity,” by Douglas Yu, TSMC
  • “Towards Cube-Sized Compute Nodes: Advanced Packaging Concepts enabling Extreme 3D Integration,” by Thomas Brunschwiler et al, IBM Research, Zurich.

Nanosensors for disease diagnostics (Session 10)

This session reviews the latest advances from microfluidics down to nanosensing for the detection of diseases such as cancer, sepsis and diabetes, using biomarkers ranging from (bio)molecules and individual cells up to in vitro tissue models.

  • “Nanofluidics for cell and drug delivery,” by Mauro Ferrari et al, Houston-Methodist Research Institute.
  • “Rapid Antibiotic Susceptibility Testing System: Life Saving BioMEMS devices,” by Sunghoon Kwon et al , Quantamatrix and celemics.
  • “Development of high frequency Bulk Accoustic Wave resonators as Biosensors and Bioactuators,” by Xuexin Duan et al, Tianjin University.
  • “Encapsulated organoids and organ-on-a-chip for cancer modelling,” by Nathalie Picollet d’hahan et al, CEA-LETI
  • “A Single Bacterium and Mammalian Cell Analysis by Ionic Current Measurements in a Microchannel,” by Noritada Kaji et al, Nagoya University
  • “Tissue Microenvironment and Cellular Imaging,” by Karen Cheung et al, University of British Columbia
  • “Microscale profiling of circulating tumour cells”  Reza Mohamadi et al, University of Toronto.

Modelling Challenges for Neuromorphic Computing (Session 11)

An exciting session addressing opportunities and challenges of efficient synaptic processes from learning models to device-circuit implementations of neuromorphic architectures.  Half the session will discuss learning models in stochastic processes with the other half devoted to opportunities and challenges in RRAM for deep neural networks and neuromorphic computing.

  • “Stochastic synapses as resources for efficient deep learning machines,” by Emre Neftci, University of California at Irvine.
  • “Attractor networks and associative memories with STDP learning in RRAM synapses,” by Elisabetha Chicca et al, University of Bielefeld
  • “Energy use constrains brain information processing,” by Renaud Jolivet et al, CERN, Switzerland.
  • “Understanding the trade-offs of device, circuit and applications in RRAM based neuromorphic computing systems,” by Hai Li et al, Duke University.
  • “Device and Circuit optimization of RRAM for Neuromorphic Computing,” by Huaqiang Wu et al, Tsinghua University.
  • “Challenges and opportunities toward online training acceleration using RRAM based hardware neural network,” by Tuohung Hou et al, National Chiao Tung University.
  • “Multiscale modeling of neuromorphic computing devices: from materials to device operations,” by Luca Larcher et al, Universita di Modena e Reggio-Emilia.

Silicon Photonics: Current status and perspectives (Session 34)

This session addresses the state-of-the-art in silicon photonics technology from high volume manufacturing, optical transceivers and interconnects to femto-joule per bit integrated nanophotonics for up-coming market applications in optical computing.

  • “Developments in 300mm Silicon Photonics using traditional CMOS fabrication methods and materials,” by Charles Baudot et al, STMicroelectronics.
  • “Reliable 50Gb/s Silicon Photonics Platform for Next-Generation Data Center Optical Interconnects,” by Philippe Absil et al, imec
  • “Advanced Silicon Photonics Technology Platform Leveraging the Semiconductor Supply Chain,” by Peter De Dobbelaere, Luxtera
  • “Femto-joule-per-bit integrated nanophotonics and challenge for optical computation,” by Masaya Notomi et al, NTT Corporation
  • “Advanced devices and packaging of Si-photonics based optical transceiver for optical interconnection,” by K Kurata et al, Photonics Electronics Technology Research Association