IEDM

IEDM Evening Panel Discussion

Tuesday, December 5
8:00 p.m. – 10:00 p.m.

The 2017 IEDM Panel will use a new format – “talk show style” – with Professor Phillip Wong (Stanford University) as the moderator.

Topic: Where will the next Intel be headquartered?

Dennard scaling has fulfilled its historic mission and traditional Moore’s Law is coming to an end. Who will drive and lead innovation in the semiconductor industry in the coming decades? We have assembled a panel of experts and industry veterans to address this important question. Who – foundry, IDM, fabless, application developers (the FAMGA) – will drive newer generations of technologies? Are foundries and IDMs becoming the “Home Depot” of architects and application developers who will drive all the value propositions? Can fabless without a system product still survive? Will system houses reach down to invest and develop the chip technologies? Who – U.S., Europe, Japan, Korea, Taiwan, China – will become the dominant chip supplier? Can R&D investments by sovereign countries change the landscape? Will countries reap benefits by investing in R&D specifically within the country? Who – material scientists, device technologists, circuit designers, system architects, application developers – will be the source of technology innovations and advances? Which region – US, Europe, Japan, China, Taiwan, Korea – will present the most innovative papers at the IEDM in a decade? Who – logic companies, memory companies, analog companies – will be the next Intel? And where will that company do research, development, and manufacturing?