Call for Papers Overview
2019 IEDM CALL FOR PAPERS
will be held at the Hilton San Francisco Union Square
San Francisco, CA
December 7-11, 2019
DOWNLOAD the 2019 Call for Papers
As in the past two years, the paper submission deadline has been moved to August 1st for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.
Customized Call for Papers for each of the technical subcommittee areas are also available:
- Circuit and Device Interaction (CDI)
- Characterization, Reliability, and Yield (CRY)
- Compound Semiconductor and High Speed Devices (CHS)
- Memory Technology (MT)
- Modeling and Simulation (MS)
- Nano Device Technology (NDT)
- Optoelectronics, Displays, and Imagers (ODI)
- Power Devices (PD)
- Process and Manufacturing Technology (PMT)
- Sensors, MEMS, and BioMEMS (SMB)
| Typical themes of interest in IEDM2018: | New or trending areas: | |
|---|---|---|
| CIRCUIT, DESIGN and DEVICE INTERACTIONS (CDI) | • Platform Technologies for continuous scaling • Neuromorphic and non-von Neumann architecture/circuits • Co-optimization of novel circuits, device, and interconnects • Variability, reliability, and characterization for robust circuit design | • New concept computing models • Stacked and monolithic 3D integration |
| CHARACTERIZATION, RELIABILITY and YIELD (CRY) | • Transistor degradation due to BTI, hot carriers • Soft-errors in logic and memory as well as error correction • ESD and latch-up mechanisms • Time dependent breakdown of dielectrics (FEOL/MEOL/BEOL) • Interconnect and contact degradation (MEOL/BEOL) | • III-V power management • Resistive devices • Emerging memories |
| COMPOUND SEMICONDUCTOR AND HIGH SPEED DEVICES (CHS) | • Devices enabling mm-wave and terahertz applications • Highly scaled devices • Devices for RF power amplifiers • Devices for low noise amplifiers | • High power density mm-wave and microwave devices • Thermal management and active device cooling |
| MEMORY TECHNOLOGY (MT) | • MRAM, STT • Charge-based memories • In-memory computing and brain-inspired computing • Memory modeling | • Neuromorphic and memory architectures for machine learning • Emerging non-volatile memories • 3D memory technologies |
| MODELING AND SIMULATION (MS) | • Material and interface modeling • Technology benchmarking of advanced devices • Compact models • Reliability and variability modeling • First principle based quantum transport | • Kinetic Monte Carlo and molecular dynamics • Process simulation with atomistic methods • Modelling for advanced manufacturing |
| NANO DEVICE TECHNOLOGY (NDT) | • Negative capacitance and sub-60mV/dec devices • 2D and low-dimensional materials and devices • Spin and magnetic devices • Emerging non-volatile memory devices • Device modeling and experimental validation | • Neuromorphic devices • Quantum computing devices • Ferroelectric devices |
| OPTOELECTRONICS, DISPLAYS, and IMAGERS (ODI) | • Large scale heterogeneous integration • Light sources • High speed photodetectors • Organic and inorganic displays • High speed and high time resolution imagers | • VCSEL/micro LED displays • Non-visible light imagers |
| POWER DEVICES (PD) | • Si, GaN and SiC power devices • Methods and designs for reduced dynamic Ron in power switches • Device integration • Fundamental studies leading to breakthrough in dielectric, thermal management, reliability, doping etc. | • High Voltage SiC MOSFETs • GaN Power devices • Novel superjunction devices • Ultra-widebandgap devices (Diamond, Ga2O3, AlN etc.) |
| PROCESS AND MANUFACTURING TECHNOLOGY (PMT) | • Packaging • 3D integration technologies • Integration technologies for photonics • EUV | • Process and technologies for quantum computing and neuromorphic • Selective deposition/etch • Artificial intelligence for manufacturing |
| SENSORS, MEMS, and BioMEMS (SMB) | • Physical and biochemical sensors • Energy harvesting and storage devices • Flexible devices for wearable applications • MEMS for Internet of Things • Bio-electronics and implantable devices for health applications | • Additive technologies and 3D printing for micro/nano-fabrication • Optomechanical devices and sensors • Hybrid organic/inorganic devices |